Function in the ecosystem

• Manufacturing equipment
• Packaging & Assembly

Profile

Finetech supports the entire die bonding lifecycle – from early feasibility and proof-of-concept to process optimization and scalable production workflows that maintain accuracy, yield and reliability.

Technologies

• Advanced packaging / chiplets
• AI hardware
• ASIC backend
• CMOS
• GaN
• Memory / storage technologies
• MEMS
• Microcontroller / embedded processors
• Photonics / silicon photonics
• Power electronics
• Quantum technologies
• RF / high frequency
• Security / trusted electronics
• Sensor technology
• SiC

Certifications

ISO9001 ISO14001 https://finetech.de/company/quality-environmental-management/